Project
Proposal of the JPNC: NP-PAS - Copper-Clad Laminate for Flexible Printed Wiring Boards (Adhesive and Non-adhesive types)
Begin
2006-07-21
Planned document number
IEC 91/616/NP
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen