Project
Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA)
Begin
2006-04-14
Planned document number
IEC 47D/653/NP
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices