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Project

Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA)

Begin

2006-04-14

Planned document number

IEC 47D/653/NP

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente  

Responsible international committee

IEC/SC 47D - Mechanical standardization for semiconductor devices  

Contact

Dr.

Konstantin Petridis

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-443

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