Project
IEC 60068-2-20 Ed. 5: Basic environmental testing procedures: Part 2: Tests - Test T: Test methods for solderability and resistance to soldering heat of leaded devices
Begin
2005-09-02
Planned document number
IEC 91/554/CD
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen