Project
Environmental Testing - Part X: Tests - Test: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste
Begin
2005-06-24
Planned document number
IEC 91/532/NP
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen