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Project

Environmental Testing - Part X: Tests - Test: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste

Begin

2005-06-24

Planned document number

IEC 91/532/NP

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 91 - Electronics assembly technology  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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