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Project

IEC xxx-xx: Test methods for lead-free solders - Part 1: Measurement of melting temperature ranges

Begin

2003-10-17

Planned document number

IEC 91/432/NP

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 91 - Electronics assembly technology  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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