Project
IEC 62218, Ed.1: Test 5E02: Surface insulation resistance, assemblies
Abstract
This test method quantifies any deleterious effects that may arise from flux residues after soldering printed circuit boards, by measuring the decrease of surface insulation resistance.
Begin
1999-10-15
Planned document number
IEC 91/197/CD
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
