Project
IEC 61190-1-7: Attachment materials for electronic assembly - Part-1-7: Requirements for lead free solder pastes for high quality interconnections in electronics assembly
Begin
2003-03-07
Planned document number
IEC 91/379/NP
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen