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Project

Amendment 2 to IEC 61189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures

Abstract

This part of IEC 61189 is a cataloque of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Begin

1996-03-22

Planned document number

IEC 52/795/CDV

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 91 - Electronics assembly technology  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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