Project
Amendment 2 to IEC 61189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures
Abstract
This part of IEC 61189 is a cataloque of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
Begin
1996-03-22
Planned document number
IEC 52/795/CDV
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
