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Project

Amendment 2 to IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Abstract

The document contains test methods for materials for electrical materials for interconnection structures.

Begin

1996-03-22

Planned document number

IEC 52/794/CDV

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 91 - Electronics assembly technology  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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