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Project

NP-CD: (Future IEC 60191-6-14): General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

Begin

2006-11-03

Planned document number

IEC 47D/671/CD

Responsible national committee

DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente  

Responsible international committee

IEC/SC 47D - Mechanical standardization for semiconductor devices  

Contact

Dr.

Konstantin Petridis

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-443

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