Project
NP-CD: (Future IEC 60191-6-14): General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Begin
2006-11-03
Planned document number
IEC 47D/671/CD
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
