Project
REPLACEMENT OF Document 47D/314/CD: Tape ball grid array package, 0,6 mm ball diameter family
Abstract
This standard specifies a tape ball grid array package family with 0,6 mm bal diameter.
Begin
1999-08-20
Planned document number
IEC 47D/314A/CD
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
