Integration aspects of liquid cooling components in electronic enclosures in the IEC 60297 series of standards
Abstract
The standard includes the aspects of integrating liquid cooling components into electronic housings in the IEC 60297 series of standards. Only components that are required for processor cooling without phase change are considered. The design of the liquid cooling system inside the information processing components such as servers is only described in the technical specification with regard to their liquid transfer interfaces. The design inside the servers is excluded from the description. The hydraulic connection outside the housing to the heat transfer station is also only considered up to the interface at the housing inlet.
Begin
2025-03-04
Planned document number
DIN VDE V 0687-297-99
Project number
02232945
