Test methods for electrical materials, printed boards and other interconnection structures and assemblies - - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards
Abstract
This International Standard specifies the correct S-parameter test method for the internal transmission circuit of a multilayer PCB for high frequency. The transmission loss test method that applies the VIPPO structure to the PCB surface contributes to improving the signal loss measurement precision and signal integrity of the internal transmission circuit of the high frequency PCB. And use of back-drilling with VIPPO structure can eliminate influence of stubs on signal transmission.
Begin
2024-12-12
Planned document number
DIN EN IEC 61189-3-720
Project number
02232784
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
