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Project

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

Abstract

This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling.

Begin

2024-11-19

Planned document number

DIN EN IEC 61760-4

Project number

02232710

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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