Project
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Abstract
This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling.
Begin
2024-11-19
Planned document number
DIN EN IEC 61760-4
Project number
02232710
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen