Project
Measurement method used in thermal design for electronics assemblies - - Part 3: Temperature measurement method for miniaturized SMDs on circuit boards
Abstract
This part of IEC 63609 specifies the temperature measuring method using thermocouple for SMDs mounted on the circuit board. This document provides the information of magnitude of the temperature measurement error and the thermocouple resistance which causing the measurement error.
Begin
2024-11-19
Planned document number
DIN EN IEC 63609-3
Project number
02232708
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
