Project
Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant
Abstract
This part of IEC 63609 specifies the locations where the temperatures are measured in the thermal design of electronic device assemblies.
Begin
2024-11-19
Planned document number
DIN EN IEC 63609-1
Project number
02232706
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
