Project
Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages
Abstract
This part of IEC 63378 specifies thermal evaluation board specifications for fine pitch semiconductor packages. Fine pitch is defined as 0,8mm or less solder pitch for BGA and 0,5mm or less solder pitch for QFP. Semiconductor packages is mounted on this thermal evaluation board using solder and then thermal resistance and thermal parameter of the packages are measured. The obtained thermal resistance and thermal parameter are listed in the datasheets of semiconductor packages.
Begin
2024-09-05
Planned document number
DIN EN IEC 63378-4
Project number
02232568
