Project
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Abstract
This part of DIN EN 60749 specifies a standard test method for determining the solderability of component housing connections which are intended to be connected to other surfaces during component assembly by using tin-lead solders (SnPb solders) or lead-free solders (Pb-free solders).
Begin
2024-07-31
Planned document number
DIN EN IEC 60749-21
Project number
02232469
