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Project

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

Abstract

This part of DIN EN 60749 specifies a standard test method for determining the solderability of component housing connections which are intended to be connected to other surfaces during component assembly by using tin-lead solders (SnPb solders) or lead-free solders (Pb-free solders).

Begin

2024-07-31

Planned document number

DIN EN IEC 60749-21

Project number

02232469

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Contact

Elena Rongen

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-429

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