Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards
Abstract
Etching process is one of the most crucial steps of circuit board fabrication. A common measure for etching capability is etch factor, whose measurement has not been standardized and consequently causes miscommunication across circuit board fabricators as well as board assemblers. This part of IEC 61189 defines the measuring method to be followed for the determination of the etch factor for traces on circuit board. This method is composed of two main parts. The first part is to prepare microsection of specimen. The other part is to observe the microsection under microscope and measure the dimensions of the trace.
Begin
2024-06-28
Planned document number
DIN EN IEC 61189-3-303
Project number
02232399
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
