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Hydrogen Technologies Standards form the basic framework for market ramp-up
More information
Climate change Standards and specifications support climate targets
More information
Smart Farming Standards and specifications are drivers for the digitalization of agriculture
More information

Project

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Computed tomography(CT) method for copper plating voids in metallized holes of PCB

Abstract

This standard specifies Computed tomography(CT) method for copper plating voids in metallized holes of PCB. This standard is applicable to metallized holes of PCB.

Begin

2023-08-31

Planned document number

DIN EN IEC 61189-3-302

Project number

02231810

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

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Daniel Failer

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DIN SPEC

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Terminology

Hydrogen Technologies Standards form the basic framework for market ramp-up

Climate change Standards and specifications support climate targets

Smart Farming Standards and specifications are drivers for the digitalization of agriculture