Abstract

This part of IEC 60068-2 establishes test methods for the resistance of electronic and electromechanical components, bare circuit boards and assemblies to solvents and cleaning processes. Tests XD1 and XD2 primarily are intended for qualification testing of components and bare circuit boards but can be adopted as well to testing of material compatibility and specific cleaning media used in manufacturing processes of components and bare circuit boards. Test XD3 is intended to determine the resistance of electronic assemblies to the various cleaning processes to which they are exposed during manufacturing, including the effects of assembly and soldering processes.

Begin

2023-05-10

Planned document number

DIN EN IEC 60068-2-88

Project number

02231591

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen