Semiconductor devices - Isolation for semiconductor devices - Part 1: Failure mechanisms and measurement methods to evaluate solid insulation for semiconductor devices
Abstract
This international standard establishes the basis for evaluating the reliability of solid insulation within semiconductor devices. It shall not be used as standalone standard for component certifications, but as reference point for component standards. For component certifications their specific standards shall be used. It describes the key breakdown mechanisms, aging behavior and subsequent failure mechanisms of the isolating semiconductor devices. Further it specifies the measurement methods to address these failure mechanisms of the isolation during development, qualification and production. Essential insulation material characteristics • safety tests • terminology This international standard specifies the failure mechanisms and measurement methods, essential insulation material characteristics, safety test and term inology for the evaluation of the reliability of solid insulation for semiconductor devices.
Begin
2023-04-21
Planned document number
DIN EN IEC 63492-1
Project number
02231553
