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Project

Semiconductor devices - Isolation for semiconductor devices - Part 1: Failure mechanisms and measurement methods to evaluate solid insulation for semiconductor devices

Abstract

This international standard establishes the basis for evaluating the reliability of solid insulation within semiconductor devices. It shall not be used as standalone standard for component certifications, but as reference point for component standards. For component certifications their specific standards shall be used. It describes the key breakdown mechanisms, aging behavior and subsequent failure mechanisms of the isolating semiconductor devices. Further it specifies the measurement methods to address these failure mechanisms of the isolation during development, qualification and production. Essential insulation material characteristics • safety tests • terminology This international standard specifies the failure mechanisms and measurement methods, essential insulation material characteristics, safety test and term inology for the evaluation of the reliability of solid insulation for semiconductor devices.

Begin

2023-04-21

Planned document number

DIN EN IEC 63492-1

Project number

02231553

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Contact

Elena Rongen

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-429

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