Project
Field Device Integration (FDI) - Part 4: FDI Packages
Abstract
This part of IEC 62769 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1.
Begin
2022-12-08
Planned document number
DIN EN IEC 62769-4
Project number
02231337
