Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices
Abstract
This part of IEC 63215 specifies power cycling test method which is taking into account of actual usage conditions of module type power electronic devices to evaluate reliability of the die attach joint materials and joining system close to the power electronic devices. This document applies to the die attach materials (near chip interconnection) applied to module type power electronic devices. The test method specified in this document is not intended to evaluate power semiconductor devices themselves. NOTE The results obtained from the test based on this document are not intended as absolute quantitative data, but for intercomparison with results of the other die attach materials using the same setup.
Begin
2022-12-08
Planned document number
DIN EN IEC 63215-4
Project number
02231333
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
