Semiconductor devices - Generic semiconductor qualification guidelines - Part 3: Guidelines for reliability qualification plans for power semiconductor module
Abstract
This part of the IEC 63287 provides guidelines for a reliability qualification plan for power semiconductor modules to assure reliability targets over the entire product life. Here, the term power semiconductor module specifically refers to isolated or non-isolated multichip semiconductor power modules with molded packages as well as to plastic-type and case-type products. Power semiconductor modules with incorporated control circuits are excluded. Devices only integrating a single IGBT chip with a single freewheeling diode chip are excluded. Devices that need external pressure for being mounted in a system are excluded, e.g. disc-type pressure pack devices. This document is not intended for military, aircraft, medical and space-related applications.
Begin
2022-11-25
Planned document number
DIN EN IEC 63287-3
Project number
02231302
