Endurance test methods for die attach materials - Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devices
Abstract
This document applies to the die attach materials and joining system applied to discrete type power electronic devices. This document specifies power cycling test method using heat-generating resistor TEG chip (herein after referred to as TEG chip), taking into account of actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system. The test method specified in this document is not intended to evaluate power semiconductor devices themselves. The test method specified in this document is not regarded as the one to be used to guarantee the reliability of the power semiconductor device packages.
Begin
2022-10-14
Planned document number
DIN EN IEC 63215-3
Project number
02231247
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
