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Project

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 61189-2-720:2024); German version EN IEC 61189-2-720:2024

Abstract

This document provides a method to evaluate specific characteristics of printed circuit boards by measuring the capacitance between conductor trays and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.

Begin

2022-04-21

Planned document number

DIN EN IEC 61189-2-720

Project number

02230983

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

draft standard

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 91/1786/CD:2022); Text in German and English
2022-09
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Contact

Daniel Failer

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