Abstract

This International Standard applies to the die attach materials and joining system applied to module type power electronic devices. This International Standard specifies temperature cycling test method which is taking into account of actual usage conditions of module type power electronic devices to evaluate reliability of the die attach joint materials and joining system, and establishes classification level for joining reliability (reliability performance index).

Begin

2022-02-22

Planned document number

DIN EN IEC 63215-5

Project number

02230818

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

draft standard

Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English
2022-06
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