Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English
Abstract
This International Standard defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid of the entire range of temperature used, and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.
Begin
2021-08-05
Planned document number
DIN EN IEC 61189-2-809
Project number
02230458
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
draft standard
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English
2022-03
Order from DIN Media
