Abstract

This International Standard specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of the IEC 61191-1 and IEC 61191-3.

Begin

2021-01-06

Planned document number

DIN EN IEC 61188-6-3

Project number

02229955

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

draft standard

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English
2022-04
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