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Project

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English

Abstract

This part of IEC 61189 defines the method to be followed for the determination of the X/Y 122 coefficient of thermal expansion of thin electrical insulating materials via the use of a 123 thermomechanical analyser (TMA). This method is applicable to materials that are solid for the 124 entire range of temperature used, and that retain sufficient rigidity over the temperature range 125 so that so that irreversible indentation of the specimen by the sensing probe does not occur.

Begin

2021-01-05

Planned document number

DIN EN IEC 61189-2-805

Project number

02229950

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

draft standard

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English
2022-03
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