Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
Abstract
This document is applicable to test thermal resistance of dielectric layer of printed circuit board using thermal transient method.
Begin
2020-12-10
Planned document number
DIN EN IEC 61189-2-808
Project number
02229915
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
draft standard
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
2022-03
Order from DIN Media
