Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 61189-2-801:2023); German version EN IEC 61189-2-801:2023
Abstract
This part of IEC 61189 defines the method to be followed for the Thermal Performance via carbon ink heating. The method employs a screened on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
Begin
2019-01-09
Planned document number
DIN EN IEC 61189-2-801
Project number
02228677
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
draft standard
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 91/1543/CD:2018); Text in German and English
2019-04
Order from DIN Media
