Project
Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of through silicon via (IEC 47A/997/CD:2016)
Abstract
This International Standard specifies a reference model of Through Silicon Via (TSV) electrical characteristics required for an interface design in Three Dimensional Integrated Circuit (3DIC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3DIC.
Begin
2017-01-24
Planned document number
DIN EN 63011-3
Project number
02227383
