Project
Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions (IEC 47A/996/CD:2016)
Abstract
This technical information is to provide general conditions and defidnitions of multichip integrated circuits, which is vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions are provided that are related to the fabrication and test of the multichip integrated circuits.
Begin
2017-01-24
Planned document number
DIN EN 63011-1
Project number
02227382
