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Project

IEC 62739-1 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

Planned document number

IEC 91/1092/FDIS

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 91 - Electronics assembly technology  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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