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Project

Test method for erosion of wave soldering equipments by molten lead free solder alloy-Part 1: Erosion test method for the metallic material without surface treatment

Begin

2011-07-15

Planned document number

IEC 91/987/CD

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 91 - Electronics assembly technology  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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