Project
IEC 62047-16 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films?wafer curvature and cantilever beam deflection methods
Begin
2013-03-22
Planned document number
IEC 47F/151/CD
Responsible national committee
DKE/K 631 - Halbleiterbauelemente
