Project
Future 61189-2-629: Test method of adhasion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application
Begin
2011-09-02
Planned document number
IEC 91/1000/NP
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen