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Project

Future 61189-2-629: Test method of adhasion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application

Begin

2011-09-02

Planned document number

IEC 91/1000/NP

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 91 - Electronics assembly technology  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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