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Project

IEC/PAS 62647-23 Ed.1: Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair handbook to address the implications of lead-free electronics and mixed assemblies

Planned document number

IEC 107/132/PAS

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 107 - Porcess management for avionics  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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