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Project

IEC 62047-18 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

Begin

2011-02-18

Planned document number

IEC 47F/155/FDIS

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Responsible international committee

IEC/SC 47F - Micro-electromechanical systems  

Contact

Elena Rongen

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-429

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