Project
IEC 60191-2 f69 Ed.1: Proposed new package outline - flange mount package with flat leads, P-SFM-F8 - To be published as outline 187E, if approved.
Begin
2010-11-19
Planned document number
IEC 47D/819/CDV
Responsible national committee
DKE/UK 631.4 - Gehäuse für Halbleiterbauelemente
Responsible international committee
IEC/SC 47D - Mechanical standardization for semiconductor devices
