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Project

Aerospace and military electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin in high-reliability electronic systems (IEC/PAS 62647-2)

Begin

2009-07-31

Planned document number

IEC 107/109/NP

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 107 - Porcess management for avionics  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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