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Project

IEC62137-3 Ed.1: Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

Begin

2008-07-25

Planned document number

IEC 91/924/CDV

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 91 - Electronics assembly technology  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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