Project
IEC 62047-13 Ed.1: SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
Begin
2009-07-03
Planned document number
IEC 47F/72/CDV
Responsible national committee
DKE/K 631 - Halbleiterbauelemente