Project
IEC 62047-11 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
Begin
2009-07-03
Planned document number
IEC 47F/154/FDIS
Responsible national committee
DKE/K 631 - Halbleiterbauelemente
