Project
IEC 61189-11 Ed.1: Test methods for electrical materials,interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys
Begin
2008-10-10
Planned document number
IEC 91/969/CD
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen