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Project

IEC 61182-2-2: Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

Begin

2008-11-07

Planned document number

IEC 91/905/CDV

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen  

Responsible international committee

IEC/TC 91 - Electronics assembly technology  

Contact

Daniel Failer

Merianstr. 28
63069 Offenbach am Main

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