Project
(Future IEC 61249-4-19): Materials for printed boards and other interconnecting structures - Part 4-19:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Begin
2008-03-07
Planned document number
IEC 91/759/NP
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen