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Hydrogen Technologies Standards form the basic framework for market ramp-up
More information
Climate change Standards and specifications support climate targets
More information
Smart Farming Standards and specifications are drivers for the digitalization of agriculture
More information

Project

IEC 62047-9,Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

Begin

2008-11-28

Planned document number

IEC 47F/31/CDV

Responsible national committee

DKE/K 631 - Halbleiterbauelemente

Responsible international committee

IEC/TC 47 - Semiconductor devices

Contact

Elena Rongen

Merianstr. 28
63069 Offenbach am Main

Tel.: +49 69 6308-429

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Economic benefits

DIN SPEC

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Terminology

Hydrogen Technologies Standards form the basic framework for market ramp-up

Climate change Standards and specifications support climate targets